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TDA1175P
LOW-NOISE VERTICAL DEFLECTION SYSTEM
. . . .
COMPLETE VERTICAL DEFLECTION SYSTEM LOW NOISE SUITABLE FOR HIGH DEFINITION MONITORS ESD PROTECTED
DESCRIPTION The TDA1175P is a monolithic integrated circuit in POWERDIP16 plastic package. It is intended for use in black and white and colour TV receivers. Low-noise makes this device particularly suitable for use in monitors. The functions incorporated are : synchronization circuit, oscillator and ramp generator, high power gain amplifier, flyback generator, voltage regulator. PIN CONNECTIONS
POWERDIP16 (Plastic Package) ORDER CODE : TDA1175P
RAMP OUTPUT SUPPLY VOLTAGE FLYBACK GROUND GROUND POWER AMPLIFIER OUTPUT POWER AMPLIFIER SUPPLY VOLTAGE REGULATED VOLTAGE
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
RAMP GENERATOR COMPENSATION AMP. INPUT GROUND GROUND OSCILLATOR SYNC. INPUT HEIGHT ADJUSTMENT
1175P-01.EPS
August 1995
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TDA1175P
BLOCK DIAGRAM
+ VS C4 DA
FREQ
P1
TDA1175P
11 OSCILLATOR
8
2
3
7 RH C9
VOLTAGE REGULATOR
FLYBACK GENERATOR
POWER AMPLIFIER
6 RG C8 YOKE
C1
SYNC
10
SYNC CIRCUIT
RAMP GENERATOR
BUFFER STAGE
PREAMPLIFIER
15 C5 C7 RE RD
4
5
12 13 TABS HEIGHT
9 C2 P2 RA
16 1 LINEARITY
14
P3 C3
RB
RC
C6
RF
1175P-02.EPS
ABSOLUTE MAXIMUM RATINGS
Symbol Vs V6, V7 V14 Io Io Io I3 I3 I10 Ptot Tstg, Tj Supply Voltage at Pin 2 Flyback Peak Voltage Power Amplifier Input Voltage Output Peak Current (non repetitive) at t = 2ms Output Peak Current at f = 50Hz, t 10s Output Peak Current at f = 50Hz, t > 10s Pin 3 DC Current at V6 < V2 Pin 3 Peak to Peak Flyback Current for f = 50Hz, tfly 1.5ms Pin 10 Current Power Dissipation : at Ttab = 90C at Tamb = 70C (free air) (1) Storage and Junction Temperature Parameter Value 35 60 + 10 - 0.5 2 2.5 1.5 100 1.8 20 4.3 1 - 40, + 150 Unit V V V V A A A mA A mA
1175P-01.TBL 1175P-02.TBL
W W C
THERMAL DATA
Symbol R th (j-tab) Rth (j-amb) Parameter Thermal Resistance Junction-pin Thermal Resistance Junction-ambient Max. Max. Value 12 80 Unit C/W C/W(1)
(1) Obtained with tabs soldered to printed circuit with minimized copper area.
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TDA1175P
ELECTRICAL CHARACTERISTICS (Tamb = 25 C, unless otherwise specified)
Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig. DC CHARACTERISTICS (Refer to the test circuits, VS = 35V) I2 I7 - I 11 - I 14 - I 16 - I 16 I16 I16 Vs V1 V3 V6 V6L V6H V8 V9 Pin 2 Quiescent Current Pin 7 Quiescent Current Oscillator Bias Current Amplifier Input Bias Current Ramp Generator Bias Current Ramp Generator Current Ramp Generator Non-linearity Supply Voltage Range Pin 1 Saturation Voltage to Ground Pin 3 Saturation Voltage to Ground Qiuescent output Voltage Output Saturation Voltage to Ground I1 = 1mA I3 = 10mA Vs = 10V, R1 = 1k, R2 = 1k Vs = 35V, R1 = 3k, R2 = 1k - I6 = 0.1A - I6 = 0.8A 4.1 8.2 I3 = 0 I6 = 0 V11 = 1V V14 = 1V V16 = 0 I9 = 20A, V16 = 0 V16 = 0 to 12V, I9 = 20A 10 1 1.5 4.4 8.8 0.9 1.8 1.4 2.8 6.5 I9 = 20A Vs = 10 to 35V V10 0.4V 2.20 6.6 6.7 6.8 1 2.27 18.5 7 8 0.1 1 0.02 20 0.2 14 17 1 10 0.3 21.5 1 35 1.4 2.5 4.7 9.4 1.2 2.2 2.1 3.1 6.9 7 2 2.35 mA mA A A A A % V V V V V V v V V V V mV/V V 1a 1a 1a 1c 1c 1d 1d 1b 1b 1b 1b 1b 1a 1b 1a 1b 1b
Output Saturation Voltage to Supply I6 = 0.1A I6 = 0.8A Regulated Voltage at Pin 8 Regulated Voltage at Pin 9
|V8| |V9| Regulated Voltage Drift with Supply , Voltage VS VS V14 Amplifier Input Reference Voltage
AC CHARACTERISTICS (Refer to the AC test circuit, VS = 22V, f = 50Hz) Is I10 V6 tfly VON fo fOPER f f VS |f| T ab Supply Current Sync. Input Current (positive or negative) Flyback Voltage Flyback Time Peak to Peak Output Noise Free Running Frequency Operating Frequency Range Synchronization Range I10 = 0.5mA, C9 = 0.1F (P1+R1) = 300k Iy = 1APP Iy = 1APP Pin 11 Connected to GND (P1 + R1) = 300k C9 = 0.1 F 36 10 14 Iy = 1APP 0.5 45 0.7 18 43.5 120 30 140 2 mA mA V ms mVpp Hz Hz Hz 2 2 2 2 2 2 2 2
Frequency Drift with Supply Voltage Vs = 10 to 35V Frequency Drift with tab Temperature Ttab = 40 to 120C
0.005 0.01
Hz/V Hz/C
2 2
1175P-03.TBL
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TDA1175P
Figure 1 : DC Test Circuits Figure 1a
I3 +V S
Figure 1b
I2 +V S
V3
I5
3 10 2 7 6 14 R1
2 11 8
V4 R2
1175P-03.EPS
7
TDA1175P
11 I8 1k 1V - I9 1V 8V 9 16 TABS - I 12
TDA1175P
16 - I 12 100k 9
14
TABS V7 - I 10 1V
1175P-04.EPS
V6
Figure 1c
+V S
Figure 1d
+V S
2 11
7 6
I4
2 11
7 6
V 4H
TDA1175P
14 TABS
TDA1175P
14 TABS
V4L 4V
1175P-05.EPS
I4 1V
1175P-06.EPS
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TDA1175P
Figure 2 : AC Test and Application Circuit for Large Screen B/W TV Set 10/20mH/1APP
VS = 22V
0.1F 100F
7
1N4001 TABS
2
470F
0.1F
3.3
6
3
220k
15
100pF
5.6k
Yoke Ry = 10 Ly = 20mH
560*
SYNC. INPUT
10
470pF
1000F
TDA1175P
14
5.6k
10F
22k
1 11
100k
8 9 16
P1 100k
R1
47k 220k 100k
0.1F C9 0.1F 0.1F
1.8k
* on application only
Figure 3 : Typical Application Circuit for VGA Monitor (RY = 10, LY = 20mH, IY = 0.8APP)
C9 3.3nF C10 560pF
R12 220k
R13 3.3 C11 0.1F
6
R11 2.7k
C12 470F 50V
VS (26V) C1 0.1F
C2 1000F 35V
D1 1N4007
7
15
2
C8 22F 35V
R7 27k R14 220 1/2W
R1 3.3k
C3 100F 35V
3 10 11
14
Y1 YOKE
TDA1175P
R8
1
47k P3 50k
8 9 16 4 5 12 13
C4 0.15F
R9 5.1k
V.LIN R6 56k R10 0.82
R2 82k P1 100k V. FREQ R5 200k C5 1.8nF P2 220k V. SIZE R4 1M
C6 0.1F C7 0.1F
R3 240k
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1175P-08.EPS
1175P-07.EPS
120k
910k
1
TDA1175P
Figure 4 : P.C. Board and Components Layout of the Circuit of Figure 3 (1:1 scale)
V-SIZE
V-FREQ C9
C12 C18
R12 P1
P2
R6 R9
C6
R18
R2
C2
R11
C4 C11 R10
R1 D1
GN D VS
C1
Y1 R8
C8 IC1
C3
R14 R7
P3 V.LIN
R4 C7
C6
R8 R6
R
BILL OF MATERIAL
Item 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Qty 4 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Reference C1, C6, C7, C11 C2 C3 C4 C5 C8 C9 C10 C12 D1 IC1 P1 P2 P3 R1 Part 0.1F 1000F 35V 100F 35V 0.15F 1.8nF 22F 35V 3.3nF 560pF 470F 50V 1N4007 TDA1175P 100k POT 220k POT 50kPOT 3.3k Item 16 17 18 19 20 21 22 23 24 25 26 27 28 29 Qty 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Reference R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 Y1 Part 82k 240k 1M 200k 56k 27k 47k 5.1k 0.82 2.7k 220k 220 1/2W YOKE
1175P-04.TBL
3.3
6/8
1175P-09.EPS
TDA1175P
MOUNTING INSTRUCTION The Rth (j-a) can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board (Figure 5) or to an external heatsink (Figure 6). The diagram of Figure 7 shows the maximum dissipable power Ptot and the Rth (j-a) as a function of the side "I" of two equal square copper areas Figure 5 : Example of P.C. Board Copper Area having a thicknessof 35 (1.4 mils). During soldering the pins temperature must not exceed 260C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 6 : External Heatsink Mounting Example
Figure 7 : Maximum Power Dissipation and Junction-ambient Thermal Resistance versus "I"
1175P-10.EPS
Figure 8 : Maximum Allowable Power Dissipation versus Ambient Temperature
1175P-12.EPS
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1175P-13.EPS
1175P-11.EPS
TDA1175P
PACKAGE MECHANICAL DATA 16 PINS - PLASTIC POWERDIP
a1
I
b Z
B e3
e
L
b1
E
D
16
9
F
1
8
Dimensions a1 B b b1 D E e e3 F i L Z
Min. 0.51 0.85 0.38
Millimeters Typ.
Max. 1.4
Min. 0.020 0.033 0.015
Inches Typ.
Max. 0.055
0.5 0.5 20 8.8 2.54 17.78 7.1 5.1 3.3 1.27
0.020 0.020 0.787 0.346 0.100 0.700
DIP16PW.TBL
0.280 0.201 0.130 0.050
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. (c) 1995 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conforms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
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PMDIP16W.EPS

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